The high bandwidth memory (hbm) global market report 2024 from The Business Research Company provides comprehensive market statistics, including global market size, regional shares, competitor market share, detailed segments, trends, and opportunities. This report offers an in-depth analysis of current and future industry scenarios, delivering a complete perspective for thriving in the industrial automation software market.
High Bandwidth Memory (HBM) Market, 2024 report by The Business Research
Company offers comprehensive insights into the current state of the market and
highlights future growth opportunities.
Market Size -
The high bandwidth memory (HBM) market size has grown exponentially in recent
years. It will grow from $1.85 billion in 2023 to $2.36 billion in 2024 at a
compound annual growth rate (CAGR) of 27.4%. The growth in the historic period
can be attributed to advancements in graphics processing units (GPUs),
emergence of big data and analytics, expansion of artificial intelligence (AI)
and machine learning (ML), Increasing complexity of workloads, and demand in
high-performance computing (HPC).
The high bandwidth memory (HBM) market size is expected to see exponential
growth in the next few years. It will grow to $6.12 billion in 2028 at a
compound annual growth rate (CAGR) of 26.9%. The growth in the forecast period
can be attributed to 5G network rollout, rapid growth in edge computing,
increased adoption of internet of things (IoT), artificial intelligence and
deep learning advancements, and growing virtual reality (VR) and augmented
reality (AR) Market. Major trends in the forecast period include integration in
autonomous vehicles, expansion in data center applications, advancements in
gaming industry, enhancements in mobile devices, and innovations in wearable
technology.
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Scope Of High Bandwidth Memory (HBM) Market
The Business Research Company's reports encompass a wide range of information,
including:
1. Market Size (Historic and Forecast): Analysis of the market's historical
performance and projections for future growth.
2. Drivers: Examination of the key factors propelling market growth.
3. Trends: Identification of emerging trends and patterns shaping the market
landscape.
4. Key Segments: Breakdown of the market into its primary segments and their
respective performance.
5. Focus Regions and Geographies: Insight into the most critical regions and
geographical areas influencing the market.
6. Macro Economic Factors: Assessment of broader economic elements impacting
the market.
High Bandwidth Memory (HBM) Market Overview
Market Drivers -
The increasing demand for high-performance computing (HPC) is expected to
propel the growth of the high-bandwidth memory (HBM) market going forward.
High-performance computing (HPC) refers to the use of advanced computing
technologies and systems to perform complex and demanding tasks at speeds and
scales beyond the capabilities of traditional computing. High-bandwidth memory
(HBM) is used in high-performance computing to provide faster and more
efficient access to data for processors by stacking memory dies vertically on a
single package, allowing for significantly increased bandwidth and reduced
latency, which enhance the overall computational performance of data-intensive
applications. For instance, in January 2023, the Department of Energy, a
US-based government department, announced a $1.8 million investment in six
projects to improve energy efficiency and productivity within the manufacturing
sector by leveraging high-performance computing (HPC) resources available at
the U.S. National Laboratories. These initiatives utilized HPC capabilities to
address manufacturing challenges, optimize processes, and contribute to a
cleaner energy future, focusing on reducing carbon emissions in steelmaking,
enhancing additive manufacturing for reduced CO2 emissions, and optimizing
battery manufacturing for electric vehicles. Therefore, the increasing demand
for high-performance computing (HPC) is driving the growth of the
high-bandwidth memory (HBM) market.
Market Trends -
Major companies operating in the high-bandwidth memory market are focused on
developing innovative products, such as high-bandwidth memory with AI
processing power, to gain a competitive edge in the market. High-bandwidth
memory with AI processing power has the computational capacity and efficiency
of hardware systems that perform tasks related to artificial intelligence (AI).
For instance, in February 2021, Samsung Electronics Co. Ltd., a South
Korea-based electronics company, launched HBM-PIM, a high-bandwidth memory (HBM)
integrated with artificial intelligence (AI) processing power. This innovative
processing-in-memory (PIM) architecture, designed for diverse AI-driven
workloads in data centers, high-performance computing (HPC) systems, and
AI-enabled mobile applications, directly brings powerful AI computing
capabilities into high-performance memory. The HBM-PIM minimizes data movement
by placing a DRAM-optimized AI engine inside each memory bank, enabling
parallel processing and significantly boosting system performance over two
times while reducing energy consumption by more than 70%. The technology,
seamlessly integrated into Samsung's existing HBM2 Aquabolt solution, holds the
potential to revolutionize AI processing efficiency without requiring hardware
or software changes.
The high bandwidth memory (HBM) market covered in this report is segmented –
1) By Memory Type: Hybrid Memory Cube (HMC), High-Bandwidth Memory (HBM)
2) By Type: HBWPIM, HBM3, HBM2E, HBM2
3) By Application: Servers, Networking, Consumer, Automotive, Other
Applications
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Regional Insights -
North America was the largest region in the high bandwidth memory (HBM) market
in 2023. Asia-Pacific is expected to be the fastest-growing region in the
forecast period. The regions covered in the high bandwidth memory (HBM) market
report are Asia-Pacific, Western Europe, Eastern Europe, North America, South
America, Middle East, Africa.
Key Companies -
Major companies operating in the high bandwidth memory (HBM) market are Samsung
Electronics Co. Ltd, Intel Corporation, International Business Machines (IBM)
Corporation, Qualcomm Incorporated, SK Hynix Inc., Fujitsu Limited, Micron
Technology Inc., Nvidia Corporation, Toshiba Corporation, Advanced Micro
Devices Inc., Western Digital Corporation, STMicroelectronics SA, Renesas
Electronics Corporation, Powerchip Technology Corporation, Cypress
Semiconductor Corporation, Nanya Technology Corporation, Macronix International
Co., Ltd., Silicon Motion Technology Corporation, Transcend Information Inc.,
Integrated Silicon Solution Inc. (ISSI), Adata Technology Co. Ltd., Netlist
Inc., Open Silicon Inc., Micronet Ltd., Winbond Electronics Corporation
Table of Contents
1. Executive Summary
2. High Bandwidth Memory (HBM) Market Report Structure
3. High Bandwidth Memory (HBM) Market Trends And Strategies
4. High Bandwidth Memory (HBM) Market – Macro Economic Scenario
5. High Bandwidth Memory (HBM) Market Size And Growth
…..
27. High Bandwidth Memory (HBM) Market Competitor Landscape And Company
Profiles
28. Key Mergers And Acquisitions
29. Future Outlook and Potential Analysis
30. Appendix
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