The molded interconnect device (mid) global market report 2024 from The Business Research Company provides comprehensive market statistics, including global market size, regional shares, competitor market share, detailed segments, trends, and opportunities. This report offers an in-depth analysis of current and future industry scenarios, delivering a complete perspective for thriving in the industrial automation software market.
Molded Interconnect Device MID Market, 2024 report by The Business Research Company
offers comprehensive insights into the current state of the market and
highlights future growth opportunities.
Market Size -
The molded interconnect device (mid) market size has grown rapidly in recent
years. It will grow from $1.51 billion in 2023 to $1.77 billion in 2024 at a
compound annual growth rate (CAGR) of 17.2%. The
growth in the historic period can be attributed to miniaturization
trends, consumer electronics evolution, automotive electronics development,
medical device innovations, shift towards smart manufacturing.
The molded interconnect device (mid) market size is expected to see rapid
growth in the next few years. It will grow to $3.27 billion in 2028 at a
compound annual growth rate (CAGR) of 16.5%. The growth in the forecast period can be
attributed to ongoing evolution of consumer electronics, rise in medical device
integration, automotive electronics growth, rapid prototyping and manufacturing
innovations. Major trends in the forecast period include regulatory compliance
and quality standards, customization and design flexibility, rapid prototyping
and manufacturing technologies, sustainability and material innovations,
industry 4.0 and smart manufacturing.
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Scope Of Molded Interconnect Device MID Market
The Business Research Company's reports encompass a wide range of information,
including:
1. Market Size (Historic and Forecast): Analysis of the market's historical
performance and projections for future growth.
2. Drivers: Examination of the key factors propelling market growth.
3. Trends: Identification of emerging trends and patterns shaping the market
landscape.
4. Key Segments: Breakdown of the market into its primary segments and their
respective performance.
5. Focus Regions and Geographies: Insight into the most critical regions and
geographical areas influencing the market.
6. Macro Economic Factors: Assessment of broader economic elements impacting
the market.
Molded Interconnect Device MID Market Overview
Market Drivers -
Growing demand for IoT devices is expected to propel the growth of the molded
interconnect devices market going forward. IoT devices refer to the billions of
physical items or things linked to the internet, all of which gather and
exchange data with other devices and systems over the internet. The rising
demand for the Internet of Things (IoT), quantum computing, and 5G, among other
emerging technology segments, combined with the connected world's increasing
demand for higher computational speed and efficiency, low-power devices, and
intelligent chipsets, has had a significant impact on the semiconductor &
electronics industry dynamics. For instance, in August 2022, according to a
blog released by Techjury, collected from IoT Analytics. The categories with
the most real corporate IoT initiatives in development included Smart City
(23%), Connected Industry (17%), and Connected Building (12%) and 97% of firms
believe that producing value from IoT-related data is challenging. Therefore,
the growing demand for IoT devices will drive the molded to interconnect
devices market.
Market Trends -
Technological development is the key trend gaining popularity in the molded
interconnect device market. Major businesses involved in molded connection
devices are concentrating on creating cutting-edge technological solutions that
are adaptable to other aspects, which is what is causing technologies like
laser plastic welding to develop. For instance, in November 2021, LPKF Laser
& Electronics, a German-based electronics manufacturing company, developed
a new technology by combining LDS and laser plastic welding. The LPKF laser
plastic welding technology produces aesthetically and functionally superior
weld seams for durable and dependable plastic couplings with virtually no
design constraints. LPKF has created WeLDS, a revolutionary technique that
blends 3D MIDs and laser plastic welding. This opens up hitherto unseen
possibilities for function integration in electronics applications.
The molded interconnect device (mid) market covered in this report is segmented
–
1) By Product: Antenna and Connectivity Modules, Connectors and Switches,
Sensors, Lighting
2) By Process: Laser Direct Structuring (LDS), Two-shot molding, Other
Processes
3) By Application: Automotive, Consumer products, Healthcare, Industrial,
Military and aerospace, Telecommunication And Computing
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Regional Insights -
Asia-Pacific was the largest region in the molded interconnect device (MID)
market share in 2023. Asia-Pacific is expected to be the fastest-growing region
in the forecast period. The regions covered in the molded interconnect device
(mid) market report are Asia-Pacific, Western Europe, Eastern Europe, North
America, South America, Middle East, Africa.
Key Companies -
Major companies operating in the molded interconnect device (mid) market report
are Molex LLC, TE Connectivity Ltd., Amphenol Corporation, LPKF Laser &
Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe,
Arlington Plating Company, MID Solutions LLC, MacDermid Inc., JOHNAN
Corporation, TactoTek Oy, Axon' Cable S.A.S, S2P Solutions, Suzhou Cicor
Technology Co. Ltd, Chogori Technology Co. Ltd., Mitsubishi
Engineering-Plastics Corporation, Galtronics Corporation Ltd., RTP Company,
BASF SE, EMS-Chemie Holding AG, Ensinger GmbH, Zeon Corporation, SelectConnect
Technologies, Multiple Dimensions AG, Cicor Group, Tesa SE, APC Automotive
Technologies LLC, Yomura Technologies Inc., T-Ink Inc., ODU GmbH & Co. KG
Table of Contents
1. Executive Summary
2. Molded Interconnect Device MID Market Report Structure
3. Molded Interconnect Device MID Market Trends And Strategies
4. Molded Interconnect Device MID Market – Macro Economic Scenario
5. Molded Interconnect Device MID Market Size And Growth
…..
27. Molded Interconnect Device MID Market Competitor Landscape And Company
Profiles
28. Key Mergers And Acquisitions
29. Future Outlook and Potential Analysis
30. Appendix
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